Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Amazon
- Location
- Onsite (Tempe, Arizona)
- Compensation
- $153k - $215k/yr
- Employment
- Full-time
- Level
- Senior Level
Posted 1 week ago
About the Role
Join Amazon's Annapurna Labs hardware team to design advanced IC packages for next-generation machine learning and data center ASICs. Execute physical layout tasks from floor planning through tape-out, collaborating with cross-functional teams to deliver high-performance, reliable silicon solutions.
Skills
IC package layout
Physical design
Floor planning
RDL routing
Substrate design
2.5D/3D-IC
Cadence APD/SiP
Synopsys IC Packaging
Mentor Xpedition
DRC
Connectivity checks
Bump map definition
Power/ground plane design
Python
TCL
Skill
Benefits
- Health insurance
- Dental insurance
- Vision insurance
- 401(k) matching
- Paid time off
- Parental leave
- Life insurance
Perks
- Restricted stock units
- Sign-on payments
Full job details
Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.
Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout — impedance-controlled routing, power plane optimization, and critical net shielding. Basic Qualifications: - Bachelor's degree in Electrical Engineering or a related field
- 5+ years of experience in IC package layout and physical design
- Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers
- Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
- Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects
- Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks)
- Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design
- Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams Preferred Qualifications: - Master's degree in Electrical or Communications Engineering or a related field
- Experience with formal verification techniques including abstraction and end-to-end checking
- Experience with ARM and various DSP ISAs
- Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards
- Experience with industry standard tools and scripting languages (Python or Perl) for automation
- MS with 3+ years in IC package layout and physical design
- Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions
- Exposure to chiplet-based or heterogeneous integration packaging architectures
- Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
- Experience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks or design rule checks
- Exposure to working with OSAT partners on NPI builds or yield improvement efforts
- Familiarity with high-bandwidth memory (HBM) integration in advanced packaging contexts
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
USA, AZ, Tempe - 153,600.00 - 215,000.00 USD annually
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.
Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout — impedance-controlled routing, power plane optimization, and critical net shielding. Basic Qualifications: - Bachelor's degree in Electrical Engineering or a related field
- 5+ years of experience in IC package layout and physical design
- Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers
- Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
- Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects
- Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks)
- Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design
- Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams Preferred Qualifications: - Master's degree in Electrical or Communications Engineering or a related field
- Experience with formal verification techniques including abstraction and end-to-end checking
- Experience with ARM and various DSP ISAs
- Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards
- Experience with industry standard tools and scripting languages (Python or Perl) for automation
- MS with 3+ years in IC package layout and physical design
- Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions
- Exposure to chiplet-based or heterogeneous integration packaging architectures
- Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers
- Experience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks or design rule checks
- Exposure to working with OSAT partners on NPI builds or yield improvement efforts
- Familiarity with high-bandwidth memory (HBM) integration in advanced packaging contexts
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, AZ, Tempe - 153,600.00 - 215,000.00 USD annually